R&D team leader hybrid packaging

We are seeking a multi-disciplinary and motivated R&D team leader for the Packaging and (micro-)Fluidics team. The team is responsible for the reliable integration of packaging concepts ranging from state-of-the-art industrial viable solutions to more early-stage exploratory and novel packaging ideas. The ideal candidate has profound expertise in electronic packaging & cartridge technologies, both from a manufacturing perspective as well as in understanding the operational physical behaviour that determines long-term reliability. This includes strong knowledge of finiteelement modelling methodologies, manufacturing processes, testing approaches, and material characterization.

Working closely with the team, you will play a key role in enabling the development of reliable electronic packaging solutions, either by validating established methods or by creating new concepts for applications that lack standard solutions, such as the integration of microfluidic Si sensor chips.

What you will do

• You oversee all activities carried out by the team, monitor progress, adjust where needed and implement the accompanying HR processes (e.g., setting goals, coaching, evaluation).
• You are responsible for the intake of new projects and assign team members to projects and tasks after evaluating scope, complexity and considering available competencies.
• You provide guidance to the team to overcome technical and operational bottlenecks and ensure seamless collaboration with all stakeholders and timely adherence to the project plans.  
• Stay up-to-date with relevant industrial players in simulation methodologies, advanced electronic & cartridge packaging. Assess incoming requests with the team and select relevant external industrial partner or develop novel in-house solutions.
• Innovate at the level of chip integration methods that strengthens the uptake of Imec’s Si portfolio with varying integration requirements from different application fields.
• Identify, propose, and concretize new project ideas aligned with strategic goals and technology roadmaps. Pitch proposals both internally and externally to secure project funding.
• Implement a structured approach to derive, monitor and document application specific (package) integration requirements, design decisions, test results and learnings to support the building of a design-rules database.
• Work closely with multi-disciplinary and cross-organizational teams of electronic design engineers, process integration engineers and application experts and facilitate a commonly supported project approach.

Who you are

• Master’s or preferably PhD in Mechanical Engineering, Materials Science, Electronics, or related field.
• You have people management experience and enjoy leading a team with solid expertise and clear goals. You create a strong team atmosphere and care for knowledge sharing, crosslearning and mutual respect.
• 10 years of experience in electronic packaging, preferably in a high-tech research or industrial environment.
• Expert knowledge of Finite element software (e.g., ANSYS, COMSOL) and mechanical CAD design tools (e.g., SolidWorks, AutoCAD).
• Expert process manufacturing knowledge and hands-on experience.
• You have strong organizational skills and show the flexibility to change between different projects according to changing priorities.
• Communicate proactively and clearly with peers, program managers, customers, and imec leadership. 
• Given the international character of imec, a fluent knowledge of English is necessary.